Articles from Enfabrica Corporation

Enfabrica Corporation, an industry leader in high-performance networking silicon for artificial intelligence (AI) and accelerated computing, today announced the availability of its Elastic Memory Fabric System “EMFASYS”, a transformative hardware and software solution designed to dramatically improve the compute efficiencies in large-scale, distributed, memory-bound AI inference workloads. EMFASYS is the first commercially available system that integrates high-performance Remote Direct Memory Access (RDMA) Ethernet networking with an abundance of parallel ComputeExpressLink (CXL) based DDR5 memory channels. The solution provides AI compute racks with fully elastic memory bandwidth and memory capacity, in a standalone appliance reachable by any GPU server at low, bounded latency over existing network ports.

Enfabrica Corporation, a pioneer in AI networking and the inventor of the Accelerated Compute Fabric (ACF) chip for efficient, high-performance scaling of GPU/accelerator clusters, today announced the opening of its India R&D operation, headquartered in Hyderabad, India. The establishment of its new office and R&D facility in India positions Enfabrica at the center of a technological hub for AI innovation to grow its world-class engineering team and scale silicon and software product development operations. The new office expands the company’s global footprint and underscores its commitment to hire and nurture top talent to deliver the industry’s most advanced networking products for scaling AI infrastructure.

Today at Supercomputing 2024 (SC24), Enfabrica Corporation, an industry leader in high-performance networking silicon for artificial intelligence (AI) and accelerated computing, announced the general availability of its groundbreaking 3.2 Terabit/sec (Tbps) Accelerated Compute Fabric (ACF) SuperNIC chip and pilot systems. The ACF solution delivers multi-port 800-Gigabit-Ethernet connectivity to GPU servers, and four times the bandwidth and multipath resiliency of any other GPU-attached network interface controller (NIC) product in the industry. The Enfabrica silicon will be available in initial quantities in calendar Q1 of 2025. This announcement solidifies Enfabrica’s position in the high-growth AI infrastructure industry and highlights its leadership role in the future of GPU compute networks.

Enfabrica Corporation, a fast-growing startup building converged networking and memory fabric silicon and software tailored to the performance and scalability demands of artificial intelligence (AI) and accelerated computing workloads, today announced its successful close of a $125 million Series B financing round. The oversubscribed round, which increases Enfabrica’s valuation more than 5X, was led by Atreides Management, with support from existing investor Sutter Hill Ventures, and includes new investors NVIDIA, IAG Capital Partners, Liberty Global Ventures, Valor Equity Partners, Infinitum Partners and Alumni Ventures.

Enfabrica Corporation, a startup building leading-edge networking silicon and software tailored to the needs of fast-evolving Artificial Intelligence (AI) and accelerated computing workloads, today emerged from stealth mode to announce a revolutionary new class of chips— called Accelerated Compute Fabric (ACF) devices. ACF devices deliver unmatched scalability, performance and total cost of ownership (TCO) for distributed AI, machine learning, extended reality, high-performance computing and in-memory database infrastructure. Enfabrica will showcase its ACF solution and its ability to solve the most critical I/O and memory scaling problems for data center AI and accelerated compute at this year’s inaugural MemCon Conference, taking place March 28-29 in Mountain View, Calif.